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CMA3000 Assembly Instructions
TABLE OF CONTENTS
1 Objective ............................................................................................................................... 3
2 Murata's 3D Stacked Wafer Level Chip-on-MEMS Package (CoM) .................................. 3
3 CMA3000 CoM Package Outline and Dimensions ............................................................. 4
4 Packing ................................................................................................................................. 6
4.1
4.2
Tape and Reel Specifications .................................................................................................. 6
Reel packing and outer box ..................................................................................................... 8
5 Printed Wiring Board (PWB) Level Guidelines .................................................................. 9
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
PWB layout ................................................................................................................................ 9
Solder Paste ............................................................................................................................ 10
Stencil ...................................................................................................................................... 10
Paste Printing .......................................................................................................................... 11
Component Picking ................................................................................................................ 11
Component Placement ........................................................................................................... 11
Reflow Soldering..................................................................................................................... 11
Moisture sensitivity level (MSL) classification..................................................................... 13
Inspection ................................................................................................................................ 13
6 Rework Guidelines ............................................................................................................. 15
6.1
6.2
6.3
6.4
6.5
6.6
6.7
Preparations ............................................................................................................................ 15
Component removal ............................................................................................................... 15
PWB cleaning .......................................................................................................................... 15
Component reuse ................................................................................................................... 15
Applying flux or solder paste ................................................................................................ 15
Component placement ........................................................................................................... 16
Reflow soldering ..................................................................................................................... 16
7 Hand Soldering Guidelines ............................................................................................... 16
8 Environmental Aspects ..................................................................................................... 16
9 Effect of the Reflow Soldering .......................................................................................... 16
10 References .......................................................................................................................... 18
11 Document Revision History .............................................................................................. 18
Murata Electronics Oy
www.muratamems.fi
TN68
2/18
Rev.A.02
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